HOT

DELO DUALBOND LT2266 sensor adhesive

lien_he

  • It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
  • Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
  • Meets RoHS 2015/863/EU standards;
  • Glue can be dispersed using robot systems with needle tips.
  • Operating temperature: -40 0C ~ 150 0C, depending on application;
  • Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
  • Meets DIN EN ISO 10993-5: cytotoxicity test.