- This adhesive suitable for two curing methods includes visible light and humidity within seconds. It has high viscosity with one component, solvent-free base on modified acrylate, and has thixotropic.

- Especially suitable for peeling resistant bonding of membranes and coil in mini loudspeaker;

- Multipurpose for plastic/plastic, glass/plastic, metal/plastic, glass/glass, and glass/metal bondings;

• DELO-GUM is a one-component, solvent-free, heat-resistant base on modified silicone adhesive (RTV-1 Heat Resistant Silicone) used in a wide range of adhesive and sealing applications;
• The heat resistance of DELO-GUM glue is usually from -50 to +180 ^oC, especially DELO-GUM 3699 glue can withstand heat up to 300 ^oC;
• DELO-GUM is widely used in bonding metal, plastic, rubber, glass, and many other materials;
• All products meet RoHS standards according to directive 2015/863/EU.

• This adhesive is suitable with both curing methods by UV light and by visible light;
• Multipurpose, especially for peel-resistant plastic bondings e.g., bonding of membrane foils into loudspeaker baskets or bonding of coils to membranes.

DELO-DUOPOX SJ8665 is a 2-component adhesive, derived from modified epoxy resin, cured at room temperature (accelerated when heated to +80^oC), temperature resistant up to +180^oC, and under packaging dual-bottles that compatible with Automix dispenser.

• It is a UV curing, high viscosity acrylate adhesive, suitable for bonding a variety of materials such as glass, PC plastic, PMMA, PA6, PBT, aluminum, stainless steel, etc. …;
• Resistant to humidity;
• Ingredients: modified acrylate, one-component glue, solvent-free, thixotropic;
• Compliant RoHS standard 2015/863/EU;
• Achieve certified biosafety standards USP 23, 1995, Class VI Plastics -70 ° C.

DELO has developed DELO DUALBOND BS3770 adhesive, a special electronics adhesive for semiconductor manufacturers to meet the rigorous quality and reliability tests of car manufacturers.

It is a modified polycarbamin acid derivate, free of solvents, 1C, light-fixable, heat-curing mandatory,  tension-equalizing, thixotropic, and reflow-resistant.

DELO-DUOPOX AD8xx adhesive group (AD = Adhesives) is a 2-component adhesive line, originating from modified epoxy resin, curing at room temperature or accelerating when heated to +80 ^o C, and is a resistant adhesive line. high temperature up to +150 ^o C and packaged in a double glue bottle, easy to apply glue both manually and automatically.

DELO MONOPOX ACxxxx adhesive group (AC = Anisotropic Conductive) is a 1-component adhesive, derived from modified epoxy resin, cured at high temperatures, heat resistant, mechanically durable, and anisotropic electrical conductivity thanks to metallic Nickel particles of the same size are mixed into the glue.