DELO DUALBOND adhesives

• Applied in many fields, especially the production of electronic components, microchips, electrical engineering, telephones... used for quick fixation of components after irradiation, bringing high durability;
• Especially for quick fixation of components that need to be cured at low temperature;
• Cured products are generally used in the temperature range of -40°C to +130°C; depending on the application, other limits may be more reasonable;
• Complies with RoHS directive 2015/863/EU;
• Halogen-free according to the criteria of IEC 61249-2-21;
• Compliant VOC content limit according to GB33372-202 criteria.

• This adhesive is suitable for two curing methods both by UV light and by humidity;
• It has medium viscosity with one component, solvent-free base on modified acrylate.

 This is an adhesive one component, solvent-free adhesive base on modified urethane acrylate.

 It allows users to choose between curing methods with light, heat, or moisture.

 Apply for many sectors as the production of electronic components, ICs, electrical engineering, telephones, automobiles, photovoltaics, precision engineering, used to mount materials and cover,…

- This adhesive suitable for two curing methods includes visible light and humidity within seconds. It has high viscosity with one component, solvent-free base on modified acrylate, and has thixotropic.

- Especially suitable for peeling resistant bonding of membranes and coil in mini loudspeaker;

- Multipurpose for plastic/plastic, glass/plastic, metal/plastic, glass/glass, and glass/metal bondings;

• As a glue compatible with both heat and UV curing, it has low air release, low shrinkage, and low CTE;
• Ingredients: modified epoxy resin, 1-component glue, solvent-free;
• High viscosity, catalytic properties (Thixotropy);
• Used for bonding between materials such as metal, glass, plastic as well as casting, fixing, or mounting around electronic components;
• Operating temperature: -40 ⁰ C ~ 150 ⁰ C, depending on the application;
• RoHS compliant 2015/863/EU, Halogen-free according to IEC 61249-2-21;
• Meets the VOC limit for adhesives according to the GB33372-2020 regulation.

• This adhesive is suitable for both curing methods by UV light and by the heat addition;
• It’s just one component base on modified polycarbamine acid with dual curing features.

- DELO DUALBOND GE4949 is a modified acrylate adhesive that cures by UV and air humidity in just a few seconds;

- Glue has good tensile-equalizing thanks to its high elongation at tear;

- Compliant RoHS standards according to 2015/863/EU;

- Compliant with VOC content limit according to GB33372-202 regulation.

• It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
• Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
• Meets RoHS 2015/863/EU standards;
• Glue can be dispersed using robot systems with needle tips.
• Operating temperature: -40 0C ~ 150 0C, depending on application;
• Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
• Meets DIN EN ISO 10993-5: cytotoxicity test.

• This is the glue that is compatible with both UV light and low temperature curing methods (+80^oC);
• The ingredient is just one component based on polycarbaminacid being modified, non-solvent.
• Non-halogen by the criteria of IEC 61248-2-21;
• Compliant with RoHS 2015/863/EU;
• The adhesive is supplied ready to use, to achieve the best performance, it can be dispensed by injection systems or use metal injection needles.

• An adhesive that is compatible with both thermal and UV curing methods;
• One component adhesive is derived from modified epoxy resin, free-bisphenol A, nonylphenols, CFC / HFC, and solvent-free.
• Range of use temperature: -40 ⁰C ~ 180 ⁰C, depending on the certain application;
• Especially for components of the camera module;
• Combined bonding between PC, PPS, FR4 resins, metal with plastic, metal with metal such as Al / Al, steel/steel,… as well as temperature-sensitive components;
• Fast fixation of components and details.

- Specialized glue in gluing electronic components, smartphone camera modules, automotive cameras, ...

- Adhesive to a variety of materials such as glass, aluminum, PC plastic, FR4, GF30, ...

- Ingredients: derived from modified polycarbamin acid, a 1-component glue, no solvents;

- Use in temperature range: -40 ⁰ C ~ 130 ⁰ C, depending on the application; 

- Compliant RoHS standard 2015/863/EU;

- Does not contain halogen elements according to IEC 61249-2-21;

- Compliant with the VOC content limit according to GB33372-2020 regulations;

DELO DUALBOND IC343 is an isotropic electrically conductive adhesive by adding conductive silver particles (Ag) to the glue, so the glue has very high conductivity, the volume resistance is only about 0.1 mOhm.cm. IC343 glue has many advantages such as: 

• Glue is derived from modified polycarbamine acid, 1 component, no solvent.
• The glue can be quickly fixed by light in just a few seconds, then cured at a low temperature.
• Glue is thixotropic, anti-creep when applying glue.
• Compliant with RoHS 2015/863/EU standard;
• Halogen-free according to IEC 61249-2-21;
• Compliant with VOC volatile organic matter content limits according to GB33372-2020.

DELO DUALBOND IC4753 is an isotropic electrically conductive adhesive by adding conductive silver particles (Ag) to the glue, so the glue has very high conductivity, the volume resistance is only about 0.1 mOhm.cm.

• Solvent-free, 1-component, modified acrylate adhesive;
• Glue has catalytic properties, prevents sagging when applying glue;
• The glue can be quickly fixed by UV light in just a few seconds, and then dried at low temperature;
• Compliant with RoHS 2015/863/EU standard;
• Halogen-free according to IEC 61249-2-21.

• A glue that is compatible with both heat and UV curing methods;
• Ingredients: is a 1-component glue, derived from modified epoxy, without solvents;
• Especially for the quick fixation of components that need to be dried at low temperature;
• Operating temperature range from -40°C to +180°C; depending on the application.
• Complies with RoHS 2015/863/EU;
• Halogen-free according to IEC 61249-2-21;
• Low coefficient of air release according to ASTM E 595-93;

DELO has developed DELO DUALBOND BS3770 adhesive, a special electronics adhesive for semiconductor manufacturers to meet the rigorous quality and reliability tests of car manufacturers.

It is a modified polycarbamin acid derivate, free of solvents, 1C, light-fixable, heat-curing mandatory,  tension-equalizing, thixotropic, and reflow-resistant.