DELO OB6769 Adhesive for camera module | HUST VN

DELO OB6769 Adhesive for camera module

lien_he

  • An adhesive that is compatible with both thermal and UV curing methods;
  • One component adhesive is derived from modified epoxy resin, free-bisphenol A, nonylphenols, CFC / HFC, and solvent-free.
  • Range of use temperature: -40 0C ~ 180 0C, depending on the certain application;
  • Especially for components of the camera module;
  • Combined bonding between PC, PPS, FR4 resins, metal with plastic, metal with metal such as Al / Al, steel/steel,… as well as temperature-sensitive components;
  • Fast fixation of components and details.

 

Introduce:

  • An adhesive that is compatible with both thermal and UV curing methods;
  • One component adhesive is derived from modified epoxy resin, free-bisphenol A, nonylphenols, CFC / HFC, and solvent-free.

The outstanding features:

  • Low outgassing according to ASTM E 595-93 (also known as NASA testing standards);
  • Halogen-free according to IEC 61249-2-21;
  • Compliant with RoHS directive 2015/863 / EU.

Application:

  • Range of use temperature: -40 0C ~ 180 0C, depending on the certain application;
  • Especially for components of the camera module;
  • Combined bonding between PC, PPS, FR4 resins, metal with plastic, metal with metal such as Al / Al, steel/steel,… as well as temperature-sensitive components;
  • Fast fixation of components and details.

 

Curing:

 

Suitable wavelength

365 nm

Irradiation time (1000 mW / cm 2 )

1~3 s

Curing time at 80 o C

50 minutes

Curing time at 100 o C

20 minutes

  •  Use UV lamps with a wavelength of 365nm. In the covered area, the adhesive can be thermally cured in the range 80 ~ 100 °C. Both methods above can be used independently.
  • Refer to DELOLUX 20/50/80 lamps.

 

Processing:

 

Typical dispersing

: Use the needle tip to apply the glue

Typical condition time (<50ml)

: 1 h

Processing time

: 3 days

Storage life in the unopened original bottle  (≤50 ml)

: -18 oC, for 3 months

 

Technology parameters:

Color (0.1 mm thick adhesive layer)

Uncured

: White

After curing

: Whitish

Color (1 mm thick adhesive layer)

: Whitish

The transparency of the adhesive layer is 0.1 mm thick

: Translucent

The transparency of the adhesive layer is 1 mm thick

: Opaque

Fluorescence

: Yes

Filler particle type

: Inorganic mineral particles

Filler particle size

: d95 = 12 µm

Filler content

: 80%

 

Technical parameters:

Density (liquid)

:      1.65 g/cm3

Viscosity (Rheometer / shear rate 10 1 / s / gap 500 µm)

:      22500 mPa.s

Compression shear strength

Glass/glass (365 nm, 200 mW/cm2, 5s)

:      20 MPa

PPS/PPS (100oC, 20 min)

:      42 MPa

PC/PC (100oC, 20 min)

:      41 MPa

FR4 / FR4 (100 o C, 20 min)

:      36 MPa

Stainless/stainless (100oC, 20 min)

:      31 MPa

Al / Al (anodized) (100 o C, 20 min)

:      41 MPa

Tensile strength
((365 nm, 200 mW / cm2 , 5s) / (100 oC, 20 min))

:      65 MPa

Elongation at tear

:      0.8 %

Young’s modulus

:      11000 MPa

Shore hardness D

:      >90

Glass transition temperature

:      160 oC

Coefficient of linear expansion (CTE)

-40 ~ +30 oC

:      26 ppm/K

160 ~ 180 oC

:      69 ppm/K

Shrinkage

:      1.7 % vol.

Water absorption

:      0.08 %

 

For more information, please contact us.

HUST Vietnam is proud to be the exclusive distributor of adhesive products, dispensing systems, adhesive curing systems, and technology transfer from DELO in Vietnam!

 

 

Bình luận

HOT

DELO DUALBOND RE3440 Adhesive for camera

1 VND

  • Applied in many fields, especially the production of electronic components, microchips, electrical engineering, telephones... used for quick fixation of components after irradiation, bringing high durability;
  • Especially for quick fixation of components that need to be cured at low temperature;
  • Cured products are generally used in the temperature range of -40°C to +130°C; depending on the application, other limits may be more reasonable;
  • Complies with RoHS directive 2015/863/EU;
  • Halogen-free according to the criteria of IEC 61249-2-21;
  • Compliant VOC content limit according to GB33372-202 criteria.
Buy
HOT

DELO DUALBOND AD4950 - Electronic Adhesive

lien_he

  • This adhesive is suitable for two curing methods both by UV light and by humidity;
  • It has medium viscosity with one component, solvent-free base on modified acrylate.

DELO DUALBOND AD465 Adhesive

lien_he

 This is an adhesive one component, solvent-free adhesive base on modified urethane acrylate.

 It allows users to choose between curing methods with light, heat, or moisture.

 Apply for many sectors as the production of electronic components, ICs, electrical engineering, telephones, automobiles, photovoltaics, precision engineering, used to mount materials and cover,…

DELO DUALBOND MF4992

lien_he

- This adhesive suitable for two curing methods includes visible light and humidity within seconds. It has high viscosity with one component, solvent-free base on modified acrylate, and has thixotropic.

- Especially suitable for peeling resistant bonding of membranes and coil in mini loudspeaker;

- Multipurpose for plastic/plastic, glass/plastic, metal/plastic, glass/glass, and glass/metal bondings;

HOT

DELO DUALBOND OB786 Adhesive for microcircuit

lien_he

  • As a glue compatible with both heat and UV curing, it has low air release, low shrinkage, and low CTE;
  • Ingredients: modified epoxy resin, 1-component glue, solvent-free;
  • High viscosity, catalytic properties (Thixotropy);
  • Used for bonding between materials such as metal, glass, plastic as well as casting, fixing, or mounting around electronic components;
  • Operating temperature: -40 0 C ~ 150 0 C, depending on the application;
  • RoHS compliant 2015/863/EU, Halogen-free according to IEC 61249-2-21;
  • Meets the VOC limit for adhesives according to the GB33372-2020 regulation.

DELO DUALBOND AD345 Adhesive

lien_he

  • This adhesive is suitable for both curing methods by UV light and by the heat addition;
  • It’s just one component base on modified polycarbamine acid with dual curing features.
HOT

DELO DUALBOND GE4949 - Adhesive for camera

lien_he

- DELO DUALBOND GE4949 is a modified acrylate adhesive that cures by UV and air humidity in just a few seconds;

- Glue has good tensile-equalizing thanks to its high elongation at tear;

- Compliant RoHS standards according to 2015/863/EU;

- Compliant with VOC content limit according to GB33372-202 regulation.

HOT

DELO DUALBOND LT2266 sensor adhesive

lien_he

  • It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
  • Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
  • Meets RoHS 2015/863/EU standards;
  • Glue can be dispersed using robot systems with needle tips.
  • Operating temperature: -40 0C ~ 150 0C, depending on application;
  • Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
  • Meets DIN EN ISO 10993-5: cytotoxicity test.