Introduce:
- An adhesive that is compatible with both thermal and UV curing methods;
- One component adhesive is derived from modified epoxy resin, free-bisphenol A, nonylphenols, CFC / HFC, and solvent-free.
The outstanding features:
- Low outgassing according to ASTM E 595-93 (also known as NASA testing standards);
- Halogen-free according to IEC 61249-2-21;
- Compliant with RoHS directive 2015/863 / EU.
Application:
- Range of use temperature: -40 0C ~ 180 0C, depending on the certain application;
- Especially for components of the camera module;
- Combined bonding between PC, PPS, FR4 resins, metal with plastic, metal with metal such as Al / Al, steel/steel,… as well as temperature-sensitive components;
- Fast fixation of components and details.
Curing:
Suitable wavelength | 365 nm |
Irradiation time (1000 mW / cm 2 ) | 1~3 s |
Curing time at 80 o C | 50 minutes |
Curing time at 100 o C | 20 minutes |
- Use UV lamps with a wavelength of 365nm. In the covered area, the adhesive can be thermally cured in the range 80 ~ 100 °C. Both methods above can be used independently.
- Refer to DELOLUX 20/50/80 lamps.
Processing:
Typical dispersing | : Use the needle tip to apply the glue |
Typical condition time (<50ml) | : 1 h |
Processing time | : 3 days |
Storage life in the unopened original bottle (≤50 ml) | : -18 oC, for 3 months |
Technology parameters:
Color (0.1 mm thick adhesive layer) | Uncured | : White |
After curing | : Whitish | |
Color (1 mm thick adhesive layer) | : Whitish | |
The transparency of the adhesive layer is 0.1 mm thick | : Translucent | |
The transparency of the adhesive layer is 1 mm thick | : Opaque | |
Fluorescence | : Yes | |
Filler particle type | : Inorganic mineral particles | |
Filler particle size | : d95 = 12 µm | |
Filler content | : 80% |
Technical parameters:
Density (liquid) | : 1.65 g/cm3 | ||
Viscosity (Rheometer / shear rate 10 1 / s / gap 500 µm) | : 22500 mPa.s | ||
Compression shear strength | Glass/glass (365 nm, 200 mW/cm2, 5s) | : 20 MPa | |
PPS/PPS (100oC, 20 min) | : 42 MPa | ||
PC/PC (100oC, 20 min) | : 41 MPa | ||
FR4 / FR4 (100 o C, 20 min) | : 36 MPa | ||
Stainless/stainless (100oC, 20 min) | : 31 MPa | ||
Al / Al (anodized) (100 o C, 20 min) | : 41 MPa | ||
Tensile strength | : 65 MPa | ||
Elongation at tear | : 0.8 % | ||
Young’s modulus | : 11000 MPa | ||
Shore hardness D | : >90 | ||
Glass transition temperature | : 160 oC | ||
Coefficient of linear expansion (CTE) | -40 ~ +30 oC | : 26 ppm/K | |
160 ~ 180 oC | : 69 ppm/K | ||
Shrinkage | : 1.7 % vol. | ||
Water absorption | : 0.08 % |
For more information, please contact us.
HUST Vietnam is proud to be the exclusive distributor of adhesive products, dispensing systems, adhesive curing systems, and technology transfer from DELO in Vietnam!