DELO DUALBOND LT2266 sensor adhesive

DELO DUALBOND LT2266 sensor adhesive

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  • It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
  • Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
  • Meets RoHS 2015/863/EU standards;
  • Glue can be dispersed using robot systems with needle tips.
  • Operating temperature: -40 0C ~ 150 0C, depending on application;
  • Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
  • Meets DIN EN ISO 10993-5: cytotoxicity test.

DELO DUALBOND LT2266 Adhesive

 Introduce:

  • It is an epoxy glue that cures at low temperatures, used for bonding temperature-sensitive sensors, camera modules, etc.
  • Adhesive meets halogen-free standards according to IEC 61248-2-21 regulations;
  • Meets RoHS 2015/863/EU standards;
  • Glue can be dispersed using robot systems with needle tips.
  • Operating temperature: -40 0C ~ 150 0C, depending on application;
  • Meets volatile organic matter (VOC) content limit standards according to GB33372-2020;
  • Meets DIN EN ISO 10993-5: cytotoxicity test.

 

Application:

  • Specialized in bonding details in camera modules, attaching chips, sensors, materials such as glass/metal, etc. for quick curing;

Glue can be used effectively with needle dispensing systems with automatic robot control or DELO DOT-PN non-contact glue release valve. The surface to be bonded needs to be clean, dry, and free of dirt or grease.

 

Curing:

Suitable UV lamp:  

LED 365nm, 400nm

The time fixed by light

1s

UV intensity (LED 365nm)

1000 mW/cm2

Curing time at 60 o C

Has UV irradiation

90 mins

No UV irradiation

120 minutes

Curing time at 80 o C

Has UV irradiation

30 minutes

No UV irradiation

60 minutes

 

Specifications:

Color (cured adhesive layer 1.0 mm thick):

black

Density:

1.32 g/ cm3

Viscosity (at 23 oC, Rheometer measurement, Shear rate 2 1/s, Gap: 500 mm):

50000 mPa.s

Thixotropic index  (Rheometer method, Gap 500 mm):

7.9

Compressive shear strength:

Al/Al

24 MPa

LCP MR25 | LCP MR25

14 MPa

Ni/Ni

20 MPa

PA/PA

21 MPa

PC/PC

30 MPa

Tensile strength:

20 MPa

Elongation at break:

110 %

Young's stress:

1100 MPa

Shore D hardness:

67

Glass transition temperature:

350C

Pot life (at 25 o C):

3 days

Storage time (-25oC ~ -15 0C with unopened containers):

6 months

Download TDS here: https://www.delo-adhesives.com/us/service-center/downloads/downloads/datasheet/DELO%20DUALBOND_LT2266_TIDB-en.pdf?show=1&type=5001&cHash=466a3e7a101e66f2e24dbbb1c2c49513  

 

Contact HUST Vietnam for more detailed advice and information. 

HUST Vietnam is proud to be the exclusive distributor of adhesives, dispensing equipment, UV curing lamps and technology transfer from DELO in Vietnam!

 

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