The High Power Burn-in System HPB-5C
Model: HPB-5C
Manufacturer: MCC - USA
I. INTRODUCTION:
The HPB-5( is designed for diverse burn-in needs of medium-power VLSI devices. The oven is configured for 16 burn-in boards with up to 24 devices per board and 64M of vector memory depth. This configuration supports one pattern zone for each burn-in board. The system works in a conventional burn-in mode up to 150C.
II. FEATURED:
• Individual temperature control for each device under test up to 150 Watts
• Individual temperature control for each device under test up to 150 Watts
• Up to 16 pattern zones.
• Tests devices up to 150( using individually variable airflow control.
• 128 digital 1/0 signals per burn-in board, plus 24 chipselect drivers. (Optional 256 1/0)
• 16 programmable voltage regulators per burn-in board.
• Up to 1080 Amps programmable voltage regulators per burn-in board.
• System capacity of up to 384 devices.
• 64M vector memory per burn-in board.
III.BENEFITS:
- Testing capabilities for high-power devices
- Ensures proper thermal stress for each device
- Measures device temperature more accurately
- Testing is more cost-effective due to greater system capacity resulting in higher throughputs
- Exercise and test high pin count devices or more parts in parallel
- Run large numbers of test vectors without time-consuming reloads
- Up to 16 different pattern zones with one burn-in board per zone
- Up to 2000 Watts of device under test power available per slot
- Translate and run device test programs
- Clock devices with built-in self-test (BIST) at high speed
- Flexibility to test complex devices
- Stores failure information without slowing down the test
- Test both logic and memory functions
- Flexible system protection control for more detailed reports of failure
Customers please contact HUST VIETNAM for detailed advice
