The High Power Burn-in System HPB-4B

Model: HPB-4B

Manufacturer: MCC - USA

I. INTRODUCTION:

High-power Burn-in test systems have become an industry standard in the semiconductor industry. The HPB-4B High Power Burn-in Test System meets the challenges created by the wide variation in heat dissipation and diverse burn-in needs of high power VLSI devices. The system provides proactive thermal control for each device to ensure appropriate thermal stress is applied during the burn-in cycle.

Very Large Scale Integration(VLSI): Large scale integration can provide 10000 - 1 million transistors.

Example: 16-32 bit microprocessor.

II. FEATURED:

• Individual Temperature Control for each devices under test up to 600 Watts.
• Test devices at maximum temperature of 150oC with a liquid-cooled heat-sink per device 
• 128 IO digital I/O channels per Burn-In Board.
• 19 individual programmable voltage regulators per Burn-In Board.

             High Current: 125Amps * 16
             Low Current: 20 Amps * 3
             Single/Dual/Quad Mode are available

• Voltage regulator featuring power clamp and current clamp modes.
• 128M vector memory with scan capability per Burn-In Board.
• New feature to fully utilize the Flash devices function.

III.BENEFITS:

• Device temperature is maintained throughout test ensuring accurate readings
• Ensures proper thermal stress for each device
• Exercise and test high pin count devices or more parts in parallel
• More devices means higher throughputs which makes testing requirements more cost effective
• High current regulators to supply required power to DUTs
• Translate and run device test programs
• Clock devices with built-in self-test at high speed
• Test both logic and memory functions
• Run large numbers of test vectors without time-consuming reloads
• Flexible system protection control for more detailed reports of failures
• Allows user to start multiple BIBs at different times

Customers please contact HUST VIETNAM for detailed advice