DELO introduces new microelectronics adhesive for ultra-fine structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new possibilities in heterogeneous integration and optical packaging applications. Able to realize unlimited freeform stru
See moreGNR Launches New Spectrometer S6 Sirius 500
With 40 years of experience in researching and manufacturing OES Spectrometers, GNR is considered one of the most prestigious and successful manufacturers in the market. On this anniversary, the company also launched a completely new model: S6 Sirius 500.
See moreBosch relies on DELO adhesives for its mild-hybrid systems
48-volt batteries can reduce short-to-medium-term carbon emissions by up to 15%. With their batteries, Bosch offers vehicle manufacturers a powerful and clever solution.
See moreDELO presents a new jet valve for ultra-small dispensing quantities
Interchangeable nozzles with different diameters and a flexible, adjustable plunger stroke ensure precise and reliable applications at different droplet sizes. Volumes of as low as 1 nl...
See moreQuickly and easily clean jet valves, needle and volume dispensers in production
Advantages at a glance:Contactless cleaning Easy integration Compact design Simple operation
See moreDELO offers another adhesive for closed-cavity packaging
DELO has developed a reliable sealant adhesive for CMOS image sensors, often used in driver monitoring systems. Glass filters can be bonded directly to the semiconductor chip using DELO DUALBOND EG6290. The electronics-specified adhesive can be dispensed
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