DELO Adhesives for LED packaging | HUST Vietnam

Thanks to their universality, LEDs are used in a wide range of applications. They offer manufacturers great design freedom and enable new types of lighting concepts – in consumer electronics, the automotive industry and sensor technology.

Functional adhesives play a key role in the manufacture of LED packages. They ensure brilliant, homogeneous diode illumination and fast production. DELO has developed a host of suitable products for both first- and second-level packaging. In first-level packaging, the adhesives are applied in the immediate vicinity of the LED semiconductor. In second-level packaging, the adhesives are used to join lenses, cover disks or housings that are used around the LED module.

DELO's adhesive portfolio for optoelectronics includes transparent and low-outgassing, tension-equalizing and electrically conductive adhesives, and die attach to structural bonding. Optical coatings with customized properties regarding transmission, reflection and absorption, as well as encapsulants to protect sensor packages, are also offered by DELO. Users can choose from products with different curing mechanisms depending on the relevant component geometry or substrate combination.

All DELO functional adhesives and sealants in its DELO PHOTOBOND, DELO DUALBOND and DELO KATIOBOND series are particularly suitable for highly automated high-speed processes with high outputs.

Properties of adhesives for LEDs:

• Low-outgassing
• Very low shrinkage
• Optically clear
• Yellowing-resistant
• Reflow-resistant

 Video describing the amount of gas emissions during the lighting process of LED lights using DELO adhesive compared to conventional epoxy glue: 

Source: DELO ( https://www.delo-adhesives.com/us/ )