Electronic adhesive with improved properties
The adhesive was specially designed for the glass-on-die assembly method. The glass filter is fixed directly onto the chip, as is typical with iBGA image sensor packaging.
Compared to other products, DELO DUALBOND EG6290 has a significantly higher Young's modulus of 2,350 MPa and a substantially higher adhesion value. Due to a glass transition temperature (Tg) of over +130 °C, the adhesive exhibits mechanically consistent behavior—even at high application temperatures, for example, during the molding process—and can compensate for temperature-dependent pressure changes. DELO DUALBOND EG6290 thus fulfills the requirements of the AEC-Q100 Grade 2 automotive industry standard.
Glass filters can be bonded directly to the semiconductor chip using DELO DUALBOND EG6290. (Image: DELO)
Advantage for dispensing and curing
The adhesive is applied via needle dispensing. Thanks to its very high thixotropy index, narrow and high bond lines can be precisely dispensed, onto which the glass filter is then joined.
Curing occurs in two successive process steps: First, the adhesive is exposed to light with a wavelength of 365 or 400 nm. Then, as a result, the glass filter is fixed within a few seconds. The adhesive typically fully cures in 15 minutes at +130 °C. Due to the rapid curing reaction, the matrix in the adhesive builds up quickly, which ensures the image sensor package is reliably sealed.
The dual curing process and the comparatively low curing temperature help minimize the pressure that usually occurs when bonding glass filters.
Adhesive for automated automobility
For example, CMOS image sensors are essential components in modern vehicles and are installed in LiDAR and driver monitoring systems. They must be completely sealed to keep out dust and moisture and maintain their safety functions over their entire service life.
With this new product, DELO is expanding its portfolio of electronic adhesives, offering yet another solution for closed-cavity packaging in addition to adhesives for glass-on-housing applications.
Learn more: Video: Closed Cavity Packaging: Reliable bonding even under harsh conditions | Electronic manufacturing
Closed Cavity Packaging: Reliable bonding even under harsh conditions | Electronic manufacturing (DELO source)
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