DELO CONTINUE LAUNCHES NEW INDUSTRIAL ADHESIVES PRODUCTS

DELO CONTINUE LAUNCHES NEW INDUSTRIAL ADHESIVES PRODUCTS

DELO – the top branch in the world about adhesive products and adhesion solves from Germany. The DELO adhesives are outstanding in variety, they were produced separately apply for different material groups, give high tensile strength and resistance with hard environments.

With a strong R&D team in research, DELO has launched a number of new and specialized product lines, including:

- DELO DUALBOND OB 6769 adhesive, solvent-free, no bisphenol A,  nonylphenols or CFC / CHC component, high ion purity, low outgassing, gaps filling, for high mechanical strength, low CTE thermal expansion index. It is a non-conductive adhesive, resistant to temperature, humidity, suitable for sealing gaps for many materials.

- DELO DUALBOND GE 7065 adhesive, high-ion purity, solvent-free, have thixotropic properties, compliant direct the RoHS 2015/863 / EU, fast light-fixation, essential for seal sealing applications.

- DELO MONOPOX AC2457 adhesive, this is an anisotropic conductive adhesive, specialized in the adhesive in flip-chip, ICs, conductive parts in flip-chip technology, used in smart cards or in in the field of smart labels sectors (smart label). This adhesive can be cured fast when heated and bond well on materials FR4, PET, copper, aluminum, silver,...

Potentially, these new products will be the perfect choice for many companies in the plastic, mechanical, electronic sectors, ...

For general information about the above three products, HUST Vietnam would like to send you a summary of technical specifications as below:

 

 DELO adhesive

DUALBOND OB 6769

DUALBOND GE 7065

MONOPOX AC2457

Specification

Component

1 component from modified epoxy resin

1 component from modified epoxy resin

1 component from modified epoxy resin

Characteristics

High mechanical strength, low CTE thermal expansion index, non-conductive

Thixotropy

Anisotropic conductive

Range of use temperature

-40 ~ 180 °C

-55 ~ +180 oC

-40 ~ +150 oC

Applications

Bonding or filling of the gaps for materials such as FR4, steel, aluminum,...

Flame resistant materials FR4, PPS resin, aluminum,…

Specialized use in flip-chip technology bonding

Dispensing

Jet needle system by minerals;

Needle-head size: ≥12μm

Filler content: 80% wt

Jet needle system by minerals;

Needle-head size: ≥7μm

Filler content: 65% wt

Jet needle system by Niken compound;

Needle-head size: ≥5.3 μm.

Cure method

UV 365nm /
Temp.: 60 ~ 80 oC

UV 400 nm/

Temp.: 130 ~ 150 oC

Only heat curing;

Minimum temp.: +100oC

Cure time

flexation = UV: 2~6s

Nhiệt: 20 ~ 50 phút

Flexation = UV: ~5s

130oC: 60 min

160oC: 20 min

180oC: 8 s

200oC: 6 s

Color

Whitish

Black, opaque

Grey

Density

1.65 g/cm3

1.71 g/cm3

1.48 g/cm3

Viscosity

22500 mPa.s

55000 mPa.s

Thixotropy Index: 4.5

40500 mPa.s

Compression shear strength (DELO Standard 5)

FR4/FR4: 36 MPa

PPS/PPS: 42 MPa

Stainless steel/ Stainless steel: 31 MPa

Al/Al: 41 MPa

FR4/FR4: 50 MPa

PPS/PPS: 22 MPa

Al/Al: 35 MPa

Toyo Al /  PET antenna,

(Si-chip 0.4x0.4 mm with Au-bumps, cured at +190oC, keep in room temperature after 24h): 74 MPa

Tensile strength

65 MPa

84 MPa

12 MPa

Elongation at tear

0.8%

1%

-

Shore hardness

> D 90

> D 90

D 85

Glass transition temperature

160 oC

218 oC

149 oC

Water absorption

0.08 % wt

0.09 % wt

0.1 % wt

Storage life

  • -40~-15oC, 6 months, with unopened cartridge volume  ≤ 55 ml
  • -25 ~ -15oC, 3 months
  • -18oC, 6 months
  • 23oC, within 1 week

 

HUST Vietnam is proud to be the exclusive distributor of adhesive products, dispensing and curing systems, and technology transfer from DELO in Vietnam.

 For more information about DELO adhesive products, please contact us!