DELO CONTINUE LAUNCHES NEW INDUSTRIAL ADHESIVES PRODUCTS
DELO – the top branch in the world about adhesive products and adhesion solves from Germany. The DELO adhesives are outstanding in variety, they were produced separately apply for different material groups, give high tensile strength and resistance with hard environments.
With a strong R&D team in research, DELO has launched a number of new and specialized product lines, including:
- DELO DUALBOND OB 6769 adhesive, solvent-free, no bisphenol A, nonylphenols or CFC / CHC component, high ion purity, low outgassing, gaps filling, for high mechanical strength, low CTE thermal expansion index. It is a non-conductive adhesive, resistant to temperature, humidity, suitable for sealing gaps for many materials.
- DELO DUALBOND GE 7065 adhesive, high-ion purity, solvent-free, have thixotropic properties, compliant direct the RoHS 2015/863 / EU, fast light-fixation, essential for seal sealing applications.
- DELO MONOPOX AC2457 adhesive, this is an anisotropic conductive adhesive, specialized in the adhesive in flip-chip, ICs, conductive parts in flip-chip technology, used in smart cards or in in the field of smart labels sectors (smart label). This adhesive can be cured fast when heated and bond well on materials FR4, PET, copper, aluminum, silver,...
Potentially, these new products will be the perfect choice for many companies in the plastic, mechanical, electronic sectors, ...
For general information about the above three products, HUST Vietnam would like to send you a summary of technical specifications as below:
DELO adhesive | DUALBOND OB 6769 | DUALBOND GE 7065 | MONOPOX AC2457 |
Specification | |||
Component | 1 component from modified epoxy resin | 1 component from modified epoxy resin | 1 component from modified epoxy resin |
Characteristics | High mechanical strength, low CTE thermal expansion index, non-conductive | Thixotropy | Anisotropic conductive |
Range of use temperature | -40 ~ 180 °C | -55 ~ +180 oC | -40 ~ +150 oC |
Applications | Bonding or filling of the gaps for materials such as FR4, steel, aluminum,... | Flame resistant materials FR4, PPS resin, aluminum,… | Specialized use in flip-chip technology bonding |
Dispensing | Jet needle system by minerals; Needle-head size: ≥12μm Filler content: 80% wt | Jet needle system by minerals; Needle-head size: ≥7μm Filler content: 65% wt | Jet needle system by Niken compound; Needle-head size: ≥5.3 μm. |
Cure method | UV 365nm / | UV 400 nm/ Temp.: 130 ~ 150 oC | Only heat curing; Minimum temp.: +100oC |
Cure time | flexation = UV: 2~6s Nhiệt: 20 ~ 50 phút | Flexation = UV: ~5s 130oC: 60 min 160oC: 20 min | 180oC: 8 s 200oC: 6 s |
Color | Whitish | Black, opaque | Grey |
Density | 1.65 g/cm3 | 1.71 g/cm3 | 1.48 g/cm3 |
Viscosity | 22500 mPa.s | 55000 mPa.s Thixotropy Index: 4.5 | 40500 mPa.s |
Compression shear strength (DELO Standard 5) | FR4/FR4: 36 MPa PPS/PPS: 42 MPa Stainless steel/ Stainless steel: 31 MPa Al/Al: 41 MPa | FR4/FR4: 50 MPa PPS/PPS: 22 MPa Al/Al: 35 MPa | Toyo Al / PET antenna, (Si-chip 0.4x0.4 mm with Au-bumps, cured at +190oC, keep in room temperature after 24h): 74 MPa |
Tensile strength | 65 MPa | 84 MPa | 12 MPa |
Elongation at tear | 0.8% | 1% | - |
Shore hardness | > D 90 | > D 90 | D 85 |
Glass transition temperature | 160 oC | 218 oC | 149 oC |
Water absorption | 0.08 % wt | 0.09 % wt | 0.1 % wt |
Storage life |
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HUST Vietnam is proud to be the exclusive distributor of adhesive products, dispensing and curing systems, and technology transfer from DELO in Vietnam.
For more information about DELO adhesive products, please contact us!